Capacitive display device

ABSTRACT

A device is described. In an example, a device comprises a capacitance sensor layer and a conductive grounded layer. The conductive grounded layer is placed under the capacitance sensor layer in a direction opposite to a targeted sensing direction of the device. The distance between the capacitance sensor layer and the conductive grounded layer is configured to remain within a threshold over a range of deformation. In other examples, a method for manufacturing a device and a module are discussed along with the features of the device.

BACKGROUND

A gesture sensitive panel is an input device which allows a user toinput a command to a computing device by selecting the indicationcontent displayed on a screen of an image display device by using his orher fingers or other objects or gestures. Herein, a gesture generallyrefers to physical interaction between a human or an object and a touchsensitive panel. One example of a gesture is touch on a touch sensitivepanel. A sensor of the panel may be capacitive, configured to measurecapacity between the gesture and the electronics of the sensor.

SUMMARY

This summary is provided to introduce a selection of concepts in asimplified form that are further described below in the detaileddescription. This summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used to limit the scope of the claimed subject matter.

A device is described. In an example, a device comprises a capacitancesensor layer and a conductive grounded layer. The conductive groundedlayer is placed under the capacitance sensor layer in a directionopposite to a targeted sensing direction of the device. The distancebetween the capacitance sensor layer and the conductive grounded layeris configured to remain within a threshold over a range of deformation.

In other examples, a method for manufacturing a device and a module arediscussed along with the features of the device.

Many of the attendant features will be more readily appreciated as theybecome better understood by reference to the following detaileddescription considered in connection with the accompanying drawings.

DESCRIPTION OF THE DRAWINGS

The present description will be better understood from the followingdetailed description read in light of the accompanying drawings,wherein:

FIG. 1 illustrates a cross section of a schematic representation of atouch sensitive display device according to an illustrative example;

FIG. 2 illustrates a cross section of a schematic representation of astructure of a touch sensitive display including grounding through aconductor according to an illustrative example;

FIG. 3 illustrates a cross section of a schematic representation of astructure of a touch sensitive display including grounding through Agpaste according to another illustrative example;

FIG. 4 illustrates a cross section of a schematic representation of astructure of a touch sensitive display including grounding through asponge according to another illustrative example;

FIG. 5 illustrates a cross section of a schematic representation of atouch sensitive display having a grounded layer at the bottom of thestack according to another illustrative example;

FIG. 6 illustrates a cross section of a schematic representation of astructure of a touch sensitive display having grounding throughconductive adhesive according to another illustrative example;

FIG. 7 illustrates a cross section of a schematic representation of astructure of a touch sensitive display having grounding through aconductive sponge according to another illustrative example;

FIG. 8 illustrates a cross section of a schematic representation of atouch sensitive display having a grounded layer above a TFT substrateaccording to another illustrative example; and

FIG. 9 illustrates a diagrammatic representation of a method formanufacturing a touch sensitive display according to an example.

Like references are used to designate like parts in the accompanyingdrawings.

DETAILED DESCRIPTION

The detailed description provided below in connection with the appendeddrawings is intended as a description of the present examples and is notintended to represent the only forms in which the present example may beconstructed or utilized. However, the same or equivalent functions andsequences may be accomplished by different examples.

FIG. 1 illustrates an example of a touch sensitive display 100. Thedisplay 100 may have a layered configuration, wherein a plurality oflayers are superposed on each other to form a stack of layered elements.The display 100 may be configured to display an adjustable visual outputto the outside of the display 100. The display 100 may be a stand-alone,operable display, a display module, or a display panel, to be integratedas a part of a device, such as a mobile phone, a smart phone, a tablecomputer, a laptop computer, a game controller, a wearable electronicdevice, etc.

The display 100 may include sub-elements to generate the text, graphics,and/or images to be displayed. Being based on layers, the display 100may include layers configured for forming the displayed information. Thecontrol for the display 100 may be carried out by elements andcomponents outside the display element. Control signals and power may besupplied to the display element for example by appropriate wirings andcables.

The display 100 may be based on any appropriate electric or electronicdisplay technology, including, for example, LCD, (Liquid CrystalDisplay), OLED (Organic Light-Emitting Diode), and AMOLED (Active-MatrixOrganic Light-Emitting Diode), graphene-based displays, and any of theirvariants.

The display 100 may be configured so that it can operate as, or as apart of, a passive display element for presenting informationone-directionally only, without any interactivity. The display 100 mayalso be configured as an interactive display, for example being operableby touching it or interacting with it using a stylus. The touchsensitive display 100 may be configured as a gesture based userinterface, and it may be based on any appropriate gesture or styluscapacitive sensing technology and their variants.

According to an example, the display 100 may be bendable or foldable.According to another example, the display 100 may be flexible. Theerrors in the touch sensitive display 100, which are caused by bendingor the distance variation of the sensing layer and main grounded layerof the device 100 under the display, may be reduced. The error may bereduced by a conductive grounded layer 102 and a capacitive sensitivitysensor, such as a capacitive sensor 101. For example, the display device100 may undergo substantial deformation, the degree of which cantypically be more than the nominal deformation of any non-bendable ornon-flexible material. By having a stable conductive grounded layer 102it is possible to reduce the sensitivity to the errors and the distancevariation between the capacitive sensor 101 and a ground point.

The layers of the display 100 of FIG. 1 are merely examples of possibleelements. The touch sensitive display 100 may comprise any appropriatenumber of elements, as long as the elements include at least onecapacitive sensor 101 with a respective grounding layer 102, and atleast one display element.

The touch sensitive display 100 includes a stack of layers asillustrated in the example of FIG. 1. As illustrated in FIG. 1, thelayered elements of the display 100 are layered in the sense that theylie on top of each other, thereby forming a stack of elements. Theseelements could also be referred to as layers. Each of the elements orlayers is formed as a generally sheet-like or plate-like structurehaving a width substantially greater than the thickness in a directionperpendicular to the direction in which the width is defined, i.e. in a“perpendicular” or “vertical” direction. In practice, the width, or moregenerally the lateral dimensions, may be, e.g., in the range of somecentimeters to some tens of centimeters, whereas the thickness of eachelement may be, e.g., some tens of micrometers. However, these numbersare merely exemplary and the thicknesses of the display elements of thedisplay 100 may vary.

The layers of the touch sensitive display 100 may include a cover glass109, an optically clear adhesive (OCA) or an optically clear resin (OCR)108, a polarizer 107, a color filter substrate or an encapsulationsubstrate 112, a capacitance sensor 101, a thin film transistor (TFT)glass 104, a TFT substrate 105, a conductive grounded layer 102, apolarizer 106, and a backlight 110. The touch sensitive display devicealso includes a part of a main ground 111 of the device. The main ground111 may be, for example, a part of a frame of the device. The distance103 between the capacitance sensor 101 and the grounded layer 102 isillustrated in FIG. 1. According to an example, the capacitance sensor101 may be positioned on the TFT glass 104. According to anotherexample, the capacitance sensor 101 may be positioned on anothersubstrate, which is not necessarily a glass substrate, for example on anencapsulation substrate or a color-filter substrate.

In the example of FIG. 1, the conductive grounded layer 102 may beplaced under the capacitive sensor 101 and to the opposite side of thecapacitive sensor 101 with respect to a targeted sensing direction 130.For example, the conductive grounded layer 102 may be placed on thebackside of the TFT substrate 105. The distance 103 between thecapacitance sensor 101 and the conductive grounded layer 102 may bestable. For example, the distance 103 may remain substantially constantwhen the capacitive sensor 101 and the conductive grounded layer 102 arebeing used in the device. The distance 103 may remain stable for examplewhen the capacitive sensor 101 and the conductive grounded layer 102 aredisplaced. The layers, including the capacitive sensor 101 and theconductive grounded layer 102, may be displaced by a force applied inthe targeted sensing direction 130. For example a touch on the touchsensitive display device 100 may displace the layers. For anotherexample, the force may be directed from below of the touch sensitivedisplay 100 by displacing main ground 111 towards the sensing layer 102.Both layers 101,102 may in this case be displaced simultaneously so thatthe distance 103 remains generally constant. The capacitive sensor 101can have a capacitive connection via the conductive grounded layer 102,instead of having a capacitive connection directly to the closestgrounded object, for example to a part of the main ground 111. Forexample, the sensitivity of the capacity detection to error caused bythe bending or the distance variation between the sensor 101 and theground point, and to other distractions, may thus be reduced.Furthermore, the distance variation of the capacity sensor 101 withrespect to the frame of the device and to the conductive grounded layer102 may be reduced.

According to an example, the conductive grounded layer 102 may betransparent, for example if it is placed between the capacitance sensor101 and the backlight 110 having illuminating features. The conductivegrounded layer 102 may be made for example of indium tin oxide, ITO,which is a transparent and colorless conducting oxide.

For example, the capacitance sensor 101 may be a self-capacitance sensoror an in-cell capacitance sensor, or combination of those. Capacitivesensing is a technology that is based on capacitive coupling that maytake human body capacitance as an input. Capacitive sensors may detectvarious things that are conductive or have a dielectric different fromthat of air. Many types of sensors use capacitance sensing, includingsensors to detect and measure proximity, position or displacement. Humaninterface devices based on capacitive sensing, such as trackpads, canfor example replace the computer mouse. Devices may also use capacitivesensing touchscreens as input devices. Capacitive sensors can furtherreplace mechanical buttons.

According to an example, the self-capacitive sensor may be based on anX-Y matrix of micro-fine capacitors, which is embedded for examplewithin a laminated glass substrate. With self-capacitance, thecapacitive load of a finger on each column or row of the matrix may bedetected. It can use frequency modulation to detect minute capacitancechanges within the conductive tracks.

According to an example, with the in-cell capacitance sensor technologysome layers may be eliminated by building the capacitors inside thedisplay 100 itself. For example, the in-cell electrodes may be depositedon a glass layer inside a LCD panel. A digitizer can be used for touchsensitivity, while the LCD screen displays the on-screen images. Thein-cell capacitance sensor display technology combines these layers intoa single layer, allowing thinner and lighter devices.

FIGS. 2-4 illustrate examples wherein the conductive grounded layer 102is placed under the TFT substrate 105, and the layer 102 is galvanicallyconnected to the main ground 111 of the display device. This can beaccomplished in several ways, for example using cover layer openings asillustrated in the example of FIG. 2, a conductive paste as illustratedin the example of FIG. 3, and a conductive sponge as illustrated in theexample of FIG. 4.

FIG. 2 illustrates an example of a structure that is configured togalvanically connect a conductive grounded layer 102 to a main ground111. In the example of FIG. 2, the conductive grounded layer 102 isconnected to a flexible printed circuit conductor 116 via a conductiveadhesive layer 115. The flexible printed circuit conductor 116 may beconnected to a LED 117. The conductive adhesive is connected to coverlayer openings on the conductor 116. The flexible printed circuitconductor 116 includes a galvanic connection 118, made for example bysoldering the flexible printed circuit conductor 116 to a main flexibleprinted circuit conductor 114. The main conductor 114 is connected tothe main ground 111. Consequently, the conductive grounded layer 102 isgalvanically connected and grounded to the main ground 111.

FIG. 3 illustrates another example of a structure that is configured togalvanically connect a conductive grounded layer 102 to a main ground111. In the example of FIG. 3, a main flexible printed circuit conductor114 is connected to the main ground 111. A conductive paste 119 connectsthe conductive grounded layer 102 to the main flexible printed circuitconductor 114. For example, Ag paste may be used to connect the layer102 to the conductor 114. Consequently, the conductive grounded layer102 is galvanically connected and grounded to the main ground 111.

FIG. 4 illustrates another example of a structure which is configured togalvanically connect a conductive grounded layer 102 to a main ground111. In the example of FIG. 4, the conductive grounded layer 102 isconnected to a main flexible printed circuit conductor 114 through aconductive sponge 120. The conductive sponge 120 may be connected toopenings of the cover layer of the conductor 114. Consequently, thegrounded layer 102 is galvanically connected to the main ground 111.

The conductive grounded layer 102 may be placed further away than whatis illustrated in the example of FIG. 1, for example to the backside ofthe display 100 as illustrated in FIG. 5. FIG. 5 illustrates anotherexample of the touch sensitive display 100. In the example of FIG. 5,the conductive grounded layer 102 is configured on the backside of thedisplay 100. For example, the conductive grounded layer 102 may beconfigured under the backlight 110. The distance 103 between thecapacitance sensor 101 and the grounded layer 102 is illustrated in FIG.5. Although there are more layers between the capacitance sensor 101 andthe conductive grounded layer 102 than in the example of FIG. 1, thedistance 103 remains stable, when the capacitive sensor 102 and theconductive grounded layer 102 are displaced. The distance 103 thusremains stable, when the touch sensitive display 100 and the respectivedevice are being used. The distance 103 is configured to be generallyconstant. Both layers 101,102 may be displaced simultaneously, alongwith all the layers of the display 100, whereby the distance 103 remainsstable and constant. The capacitive sensor 101 can have a capacitiveconnection via the conductive grounded layer 102, instead of having acapacitive connection directly to the main ground 111.

According to an example, the conductive grounded layer 102 may benon-transparent if it is placed under the backlight 110 or if thedisplay system is an Organic Light Emitting Diode, OLED.

FIGS. 6 and 7 illustrate examples wherein the conductive grounded layer102 is placed under the backlight 110, and the layer 102 is galvanicallyconnected to the main ground 111 of the device. There may be severalexamples for this, for example using conductive taping as illustrated inFIG. 6 or a conductive sponge as illustrated in FIG. 7. According toanother example, the layer under the backlight 110 may also be of aconductive sponge type and may be directly connected to the main ground111.

FIG. 6 illustrates an example of a structure wherein a conductivegrounded layer 102 is galvanically connected to a main ground 111. Theconductive grounded layer 102 is situated under a backlight 110. A layerof conductive adhesive 121 connects the conductive grounded layer 102 toa main flexible printed circuit conductor 114. The layer of conductiveadhesive 121 may be under the grounded layer 102 and the conductor 114.The conductor 114 is connected to the main ground 111, and consequentlythe grounded layer 102 is galvanically connected to the main ground 111.

FIG. 7 illustrates an example of a structure wherein a conductivegrounded layer 102 is galvanically connected to a main ground 111. Inthe example of FIG. 7, the conductive grounded layer 102 is situatedunder a backlight 110. A conductive sponge 122 connects the groundedlayer 102 to the main ground 111. A main flexible printed circuitconductor 114 is shown in the example of FIG. 7; however, it is notneeded for the galvanic grounding in the example, as the grounded layer102 is connected to the main ground 111 by a direct instrument betweenthem.

FIG. 8 illustrates another example of the touch sensitive display 100.In the example of FIG. 8, the conductive grounded layer 102 isconfigured above the TFT substrate 105. An intermediate layer 123 may beconfigured between the conductive grounded layer 102 and the capacitivesensor 101. For example, a layer of TFT glass 104 may be manufacturedbetween the layer 102 and the sensor 101.

FIG. 9 illustrates an example of a method for manufacturing a touchsensitive display 100. The display may be similar to any of the examplesof the displays discussed above. An example of the method may also beperformed in alternative steps, or order as described below. In step123, a layer of a capacitance sensor 101 is placed between layers of thedisplay 100 of the device. For example, the capacitance sensor 101 maybe placed above a TFT substrate 105 and under a CF substrate 112. Instep 124, a layer of a conductive ground element 102 is placed under thelayer of the capacitance sensor 101 in a direction opposite to atargeted sensing direction of the touch sensitive display device. Forexample, the grounded layer 102 may be placed under the TFT substrate105, possibly even as far as under the backlight 110. In step 125, thedistance between the layer of the capacitance sensor 101 and the layerof the conductive grounded element 102 is configured stable. Thedistance remains constant when the device is used or when the layers aredisplaced. According to an example, the display 100 can be integratedinto the device. According to another example, the display 100 can bemade interoperable with the device. In this case, the device may notrequire a specific interoperability software algorithm, as the display100 is interoperable with the device after the manufacturing process.

While examples have been discussed in the form of a device such as asmartphone, as discussed, other bendable and non-bendable computingdevices may be used equivalently, such as tablet computers, netbookcomputers, laptop computers, desktop computers, processor-enabledtelevisions, personal digital assistants (PDAs), touchscreen devicesconnected to a video game console or set-top box, or any other computingdevice that has a gesture sensitive display unit and is enabled to applyit.

The term ‘computer’, ‘computing-based device’, ‘apparatus’ or ‘mobileapparatus’ is used herein to refer to any device with processingcapability such that it can execute instructions. Those skilled in theart will realize that such processing capabilities are incorporated intomany different devices and therefore the terms ‘computer’ and‘computing-based device’ each include PCs, servers, mobile telephones(including smart phones), tablet computers, set-top boxes, mediaplayers, games consoles, personal digital assistants and many otherdevices.

The manufacturing methods and functionalities described herein may beoperated by software in machine readable form on a tangible storagemedium e.g. in the form of a computer program comprising computerprogram code means adapted to perform all the functions and the steps ofany of the methods described herein when the program is run on acomputer and where the computer program may be embodied on a computerreadable medium. Examples of tangible storage media include computerstorage devices comprising computer-readable media such as disks, thumbdrives, memory etc. and do not include propagated signals. Propagatedsignals may be present in tangible storage media, but propagated signalsper se are not examples of tangible storage media. The software can besuitable for execution on a parallel processor or a serial processorsuch that the method steps may be carried out in any suitable order, orsimultaneously.

This acknowledges that software can be a valuable, separately tradablecommodity. It is intended to encompass software, which runs on orcontrols “dumb” or standard hardware, to carry out the desiredfunctions. It is also intended to encompass software which “describes”or defines the configuration of hardware, such as HDL (hardwaredescription language) software, as is used for designing silicon chips,or for configuring universal programmable chips, to carry out desiredfunctions.

Those skilled in the art will realize that storage devices utilized tostore program instructions can be distributed across a network. Forexample, a remote computer may store an example of the process describedas software. A local or terminal computer may access the remote computerand download a part or all of the software to run the program.Alternatively, the local computer may download pieces of the software asneeded, or execute some software instructions at the local terminal andsome at the remote computer (or computer network). Alternatively, or inaddition, the functionally described herein can be performed, at leastin part, by one or more hardware logic components. For example, andwithout limitation, illustrative types of hardware logic components thatcan be used include Field-programmable Gate Arrays (FPGAs),Application-specific Integrated Circuits (ASICs), Application-specificStandard Products (ASSPs), System-on-a-chip systems (SOCs), ComplexProgrammable Logic Devices (CPLDs), etc.

Any range or device value given herein may be extended or alteredwithout losing the effect sought. Also any example may be combined toanother example unless explicitly disallowed.

Although the subject matter has been described in language specific tostructural features and/or acts, it is to be understood that the subjectmatter defined in the appended claims is not necessarily limited to thespecific features or acts described above. Rather, the specific featuresand acts described above are disclosed as examples of implementing theclaims and other equivalent features and acts are intended to be withinthe scope of the claims.

It will be understood that the benefits and advantages described abovemay relate to one example or may relate to several examples. Theexamples are not limited to those that solve any or all of the statedproblems or those that have any or all of the stated benefits andadvantages. It will further be understood that reference to ‘an’ itemrefers to one or more of those items.

The steps of the methods described herein may be carried out in anysuitable order, or simultaneously where appropriate. Additionally,individual blocks may be deleted from any of the methods withoutdeparting from the spirit and scope of the subject matter describedherein. Aspects of any of the examples described above may be combinedwith aspects of any of the other examples described to form furtherexamples without losing the effect sought.

The term ‘comprising’ is used herein to mean including the method,blocks or elements identified, but that such blocks or elements do notcomprise an exclusive list and a method or apparatus may containadditional blocks or elements.

According to the above, some examples are directed to a device,comprising: a capacitance sensor layer; and a conductive grounded layer,wherein the conductive grounded layer is placed under the capacitancesensor layer in a direction opposite to a targeted sensing direction ofthe device; wherein a distance between the capacitance sensor layer andthe conductive grounded layer is configured to remain within a thresholdover a range of deformation. Additionally or alternatively to one ormore of the examples, the distance is configured stable when at leastone of the layers is displaced or bent. Additionally or alternatively toone or more of the examples, the distance is configured constant whenboth layers are displaced. Additionally or alternatively to one or moreof the examples, including a display comprising two or more layers,wherein the capacitance sensor layer is configured between the layers ofthe display. Additionally or alternatively to one or more of theexamples, the device comprises a touch sensitive display device, and atleast one of the layers is displaced by touch on the touch sensitivedisplay device, wherein the touch is directed in the targeted sensingdirection. Additionally or alternatively to one or more of the examples,the device comprises a bendable touch sensitive display device.Additionally or alternatively to one or more of the examples, thecapacitance sensor layer is configured to capacitively detect touch on asurface of the device. Additionally or alternatively to one or more ofthe examples, the capacitance sensor layer comprises a self-capacitancesensor layer or an absolute capacitance sensing layer. Additionally oralternatively to one or more of the examples, the capacitance sensorlayer comprises an in-cell capacitance sensor layer. Additionally oralternatively to one or more of the examples, the conductive groundedlayer is galvanically connected to a main ground of the device.Additionally or alternatively to one or more of the examples, theconductive grounded layer is placed under a thin film transistor, TFT,layer, and the capacitance sensor layer is placed above the TFT layer.Additionally or alternatively to one or more of the examples, theconductive grounded layer is placed above a backlight of the displaydevice. Additionally or alternatively to one or more of the examples,the conductive grounded layer is transparent. Additionally oralternatively to one or more of the examples, further including: a firstflexible conductor, which is connected to a main ground of the device;and a second flexible conductor, which is connected to the conductivegrounded layer and to the first flexible conductor, wherein the secondflexible conductor is connected to the conductive grounded layer by alayer of conductive adhesive. Additionally or alternatively to one ormore of the examples, further including a flexible conductor, which isconnected to a main ground of the device, wherein the conductivegrounded layer is connected to the flexible connector by a conductivepaste, by a conductive sponge, or by a conductive adhesive. Additionallyor alternatively to one or more of the examples, the conductive groundedlayer is placed under a backlight of the device. Additionally oralternatively to one or more of the examples, the conductive groundedlayer is non-transparent. Additionally or alternatively to one or moreof the examples, the conductive grounded layer is directly connected toa main ground of the device through a conductive sponge.

Some examples are directed to a method for manufacturing a device,comprising: placing a layer of a capacitance sensor between layers of adisplay of the device; and placing a layer of a conductive groundelement under the layer of the capacitance sensor in a directionopposite to a targeted sensing direction of the device; wherein adistance between the layer of the capacitance sensor and the layer ofthe conductive grounded element is configured to remain within athreshold over a range of deformation.

Some examples are directed to a touch sensitive display module,comprising: a capacitance sensor element; and a conductive groundedelement, wherein the conductive grounded element is placed under thecapacitance sensor element in a direction opposite to a targeted sensingdirection of the touch sensitive display module; wherein a distancebetween the capacitance sensor element and the conductive groundedelement is configured generally constant.

It will be understood that the above description is given by way ofexample only and that various modifications may be made by those skilledin the art. The above specification, examples and data provide acomplete description of the structure and use of exemplary embodiments.Although various examples have been described above with a certaindegree of particularity, or with reference to one or more individualexamples, those skilled in the art could make numerous alterations tothe disclosed examples without departing from the spirit or scope ofthis specification.

1. A device, comprising: a capacitance sensor layer; and a conductivegrounded layer, wherein the conductive grounded layer is placed underthe capacitance sensor layer in a direction opposite to a targetedsensing direction of the device; wherein a distance between thecapacitance sensor layer and the conductive grounded layer is configuredto remain within a threshold over a range of deformation.
 2. The deviceof claim 1, wherein the distance is configured stable when at least oneof the layers is displaced or bent.
 3. The device of claim 1, whereinthe distance is configured constant when both layers are displaced. 4.The device of claim 1, including a display comprising two or morelayers, wherein the capacitance sensor layer is configured between thelayers of the display.
 5. The device of claim 1, wherein the devicecomprises a touch sensitive display device, and at least one of thelayers is displaced by touch on the touch sensitive display device,wherein the touch is directed in the targeted sensing direction.
 6. Thedevice of claim 1, wherein the device comprises a bendable touchsensitive display device.
 7. The device of claim 1, wherein thecapacitance sensor layer is configured to capacitively detect touch on asurface of the device.
 8. The device of claim 1, wherein the capacitancesensor layer comprises a self-capacitance sensor layer or an absolutecapacitance sensing layer.
 9. The device of claim 1, wherein thecapacitance sensor layer comprises an in-cell capacitance sensor layer.10. The device of claim 1, wherein the conductive grounded layer isgalvanically connected to a main ground of the device.
 11. The device ofclaim 1, wherein the conductive grounded layer is placed under a thinfilm transistor, TFT, layer, and the capacitance sensor layer is placedabove the TFT layer.
 12. The device of claim 1, wherein the conductivegrounded layer is placed above a backlight of the display device. 13.The device of claim 12, wherein the conductive grounded layer istransparent.
 14. The device of claim 1, further including: a firstflexible conductor, which is connected to a main ground of the device;and a second flexible conductor, which is connected to the conductivegrounded layer and to the first flexible conductor, wherein the secondflexible conductor is connected to the conductive grounded layer by alayer of conductive adhesive.
 15. The device of claim 1, furtherincluding a flexible conductor, which is connected to a main ground ofthe device, wherein the conductive grounded layer is connected to theflexible connector by a conductive paste, by a conductive sponge, or bya conductive adhesive.
 16. The device of claim 1, wherein the conductivegrounded layer is placed under a backlight of the device.
 17. The deviceof claim 16, wherein the conductive grounded layer is non-transparent.18. The device of claim 16, wherein the conductive grounded layer isdirectly connected to a main ground of the device through a conductivesponge.
 19. A method for manufacturing a device, comprising: placing alayer of a capacitance sensor between layers of a display of the device;and placing a layer of a conductive ground element under the layer ofthe capacitance sensor in a direction opposite to a targeted sensingdirection of the device; wherein a distance between the layer of thecapacitance sensor and the layer of the conductive grounded element isconfigured to remain within a threshold over a range of deformation. 20.A touch sensitive display module, comprising: a capacitance sensorelement; and a conductive grounded element, wherein the conductivegrounded element is placed under the capacitance sensor element in adirection opposite to a targeted sensing direction of the touchsensitive display module; wherein a distance between the capacitancesensor element and the conductive grounded element is configuredgenerally constant.